Each of the three modules exhibits low conduction and switching losses, combining with best-in-class thermal resistance and high voltage isolation to deal with 800V bus v

The first member of the ecoSpin family to be launched is the ECS640A, a three-phase brushless DC (BLDC) motor controller designed for reliable high-voltage operation up t

Using a 38mm sensor, the device delivers +/-50 arcsec accuracy at 6,000 RPM. The NCS32100 can support speeds up to 100,000 RPM with reduced accuracy.

The new devices provide reliable, high-efficiency performance for energy infrastructure and industrial drive applications and highlight onsemi’s position as a leader in i

onsemi's latest EliteSiC 750 V M3 die is used in a full bridge power module delivering several hundred kWs of power.

The NCN26010 enables more than 40 nodes on a single twisted pair, exceeding five times the amount of nodes requested by the IEEE 802.3cg standard, to reduce installation

By reducing onsemi’s energy consumption by 12.84 million kWh compared to its energy use in 2021, the move to the new headquarters will positively impact onsemi on the jou

This latest collaboration between the two companies is another example of onsemi’s strength in developing sensors for high-end cinematography that elevate image quality.

The new microcontroller also addresses heightened security concerns resulting from more sensors and with that more possible attack vectors.

The AR0822 is an 8-megapixel (MP) stacked 1/1.8−inch (8.81mm diagonal) back-side illuminated (BSI) CMOS digital image sensor based upon a 2.0 µm pixel.

The new 1200 V Trench Field Stop VII (FS7) IGBTs are used to boost input to high voltage (Boost stage) as well as the inverter to provide an AC output in high switching f

Users have ultimate power and flexibility to create high-fidelity system-level PLECS models when the Elite Power Simulator is deployed in conjunction with the Self-Servic

The high-performance sensor is designed for a variety of applications including machine vision cameras, AR/VR/MR headsets, autonomous mobile robots (AMRs) and barcode rea

The new generation of SiC MOSFETs employ a novel active cell design combined with advanced thin wafer technology enabling best in class figure of merit Rsp (Rdson*area) f

The ArrayRDM-0112A20-QFN is the first automotive qualified SiPM product in the market, ready for the growing demands in LiDAR applications for the automotive industry and