The high-performance sensor is designed for a variety of applications including machine vision cameras, AR/VR/MR headsets, autonomous mobile robots (AMRs) and barcode rea

The new generation of SiC MOSFETs employ a novel active cell design combined with advanced thin wafer technology enabling best in class figure of merit Rsp (Rdson*area) f

The ArrayRDM-0112A20-QFN is the first automotive qualified SiPM product in the market, ready for the growing demands in LiDAR applications for the automotive industry and

The new NCP1680 CrM totem pole PFC controller employs novel current limit architecture and line phase detection while incorporating proven control algorithms to deliver a

The NCL31000 and NCL31001 LED drivers allow manufacturers to develop LED luminaires with light-based positioning technology and visible light communication.

The XGS 16000 is a 16 Megapixel (Mp) sensor that provides high quality, global shutter imaging for factory automation applications including robotics and inspection syste

The transaction is expected to better position onsemi to secure and grow supply of SiC and meet rapidly growing customer demand for SiC-based solutions in the sustainable

Each of the three modules exhibits low conduction and switching losses, combining with best-in-class thermal resistance and high voltage isolation to deal with 800V bus v

The first member of the ecoSpin family to be launched is the ECS640A, a three-phase brushless DC (BLDC) motor controller designed for reliable high-voltage operation up t

Using a 38mm sensor, the device delivers +/-50 arcsec accuracy at 6,000 RPM. The NCS32100 can support speeds up to 100,000 RPM with reduced accuracy.

The new devices provide reliable, high-efficiency performance for energy infrastructure and industrial drive applications and highlight onsemi’s position as a leader in i

onsemi's latest EliteSiC 750 V M3 die is used in a full bridge power module delivering several hundred kWs of power.

By reducing onsemi’s energy consumption by 12.84 million kWh compared to its energy use in 2021, the move to the new headquarters will positively impact onsemi on the jou

The new microcontroller also addresses heightened security concerns resulting from more sensors and with that more possible attack vectors.

The AR0822 is an 8-megapixel (MP) stacked 1/1.8−inch (8.81mm diagonal) back-side illuminated (BSI) CMOS digital image sensor based upon a 2.0 µm pixel.